Closely behind the heels of MediaTek, a leakster has allegedly leaked the specs of Qualcomm’s highly anticipated chipset, the Snapdragon 830. It is rumored to be insider information and the leakster announced on Weibo that it has been confirmed by Qualcomm’s CEO. Earlier this week, we had a report of MediaTek’s COO confirming the specs of the Helio X30 flagship chipset. The processor will be made on a brand new 10nm process and will support up to 8 gigs of LPDDR4 RAM. Will the Snapdragon 830 be able to replicate the success of the Snapdragon 820? Or will it be plagued by heating issues?
After Qualcomm, the next name when it comes to system-on-chip solutions is MediaTek. The Taiwanese company has been around for nearly 20 years and they’ve some of the most affordable solutions that provide stellar performance. Their Helio chipsets have been well received all over, but they always lag in performance compared to their Qualcomm Snapdragon counterparts. Looking forward to making a change, MediaTek COO, Zhu Shangzu announced the MediaTek Helio X30 chipset and confirmed some of the specs of their latest flagship offering.
Just when you thought there couldn’t be a better SoC than the Snapdragon 820, here comes another one from Qualcomm, the Snapdragon 821. Qualcomm was lauded at the Mobile World Conference this year for the Snapdragon 820 and almost 80% of the flagships released this year use it. Other competitors of the SD820 include the Exynos 8890 from Samsung, A9 from Apple and the Kirin 950 from Huawei. But none of these chipsets come close to the 820, apart from Apple’s A9, which is still superior in single-core performance.
The Qualcomm Snapdragon 820 is the latest and the greatest system on chip nowadays, powering high-end smartphones and tablets from various manufacturers(HTC 10, Samsung Galaxy S7, LG G5 to name just a few), but things are going to change quickly, as the soon-to-arrive LeEco smartphone is rumored to pack the Snapdragon 823.
Smart accessories in the sports world are nothing new, but we’re just now beginning to see some of the cool contraptions come to consumers. Smart Leggings are a new concept that we could see plenty of people getting behind, and Qualcomm has climbed on board with their new chip to help make them a reality.
Snapdragon is a name folks know in the mobile world and their chips are found in plenty of consumer products around the globe. A Tencent ZEROTECH Drone dubbed YING will be one of the newest gadgets to carry the company’s processor, and it’s something to get excited about if you own a mobile device.
It’s been a while since we’ve seen a processor discussed as much as Qualcomm’s Snapdragon 810. The chip has been a consistently in the news for all the wrong reasons, and today the company may have confirmed one of the rumors surrounding its new 64-bit chip.
Each year smartphone processors get a bit quicker, and the Snapdragon SoC’s are embedded in millions of handsets. We all know the Snapdragon 810 is in the works, and now you’ll be able to get one as the Snapdragon 810 MDP Smartphone specs and pricing have just been revealed.
There are more Desire variants than you can shake a stick at, and if a new leak is true, we’re about to add another to the list. The device is known as the HTC A11, and it’s said to have the Snapdragon 410 under the hood.
Just released to devs is the new Qualcomm Toq smartwatch SDK, this new update will allow developers to create better apps that will work with this product. The Qualcomm Toq SDK now offers developers the ability to request permission to become Toq-enabled, please remember that permission is required. It also brings new features such as […]