Apple iPad 2 Release, Possible Features & New Qualcomm Chips

It is going to be very busy for Apple in 2011 when they release its new devices, so what do we know so far today in the way of release and specs of the new iPad 2.

The Apple iPad 2 is expected to release by the end of February 2011, well 100 days from today to be exact according to 9to5Mac. Foxconn will start to ship out 400,000 to 600,000 iPad 2 units but this is not yet announced official so please read with an open mind until we get the official report.

Would be good to see Apple start its mass production in January but the only date we can find is Feb 2011, apparently the late Feb release is down to the testing of the firmware according to UberGizmo, for more information about the iPad 2 and its release please visit DigiTimes.

The iPad 2 is expected to feature: Video phone feature, presumably FaceTime, Retina display, Thinner glass on the display panels, which could mean it’s slightly lighter, USB connection and 3-axis gyroscope. Now talking about the Retina Display on the new Apple tablet seems like a long shot, we wrote about this a few days ago when we found some interesting news via The iPad Guide who said that retina display on this device would be very difficult indeed. Please do have your say about this matter in the comments area below.

Back to DigiTimes, they say that Taiwan Semiconductor Manufacturing Company (TSMC) will push out 1.8 million wafers for production of Qualcomm chips in 2011, now thisis much more than 2010 when they reserved 1.1 million units. So that is an extra 700,000 chips for Apple devices such as the iPhone 5 and iPad 2. Qualcomm will apparently supply baseband chips for the iPad 2 and iPhone 5.

Just a quick recap about the new iPhone 5, apparently this smartphone will feature a Pico projector. Please read more about that here.


4 thoughts on “Apple iPad 2 Release, Possible Features & New Qualcomm Chips”

  1. Nikhil says:

    When you say, "that is an extra 700,000 chips for Apple devices" it is probably way more than that. The DigiTimes article refers to the silicon wafers that chips are manufactured on. Since TSMC is using 300mm wafers, and I don't think the baseband chips are terribly large at all, a wafer probably has a couple hundred of the chips on it. So we're talking 10s of millions of chips, but hundreds of thousands of wafers. 🙂

  2. Nicole says:

    I'm really looking forward to the new iPad 2. I purposefully restrained myself from purchasing the first with the intention of getting an iPad without all the initial bugs and snags. I plan on connecting mine to my Sling Adapter and I'm hoping the picture resolution will provide great viewing since I'll be watching live TV on it. As an employee in DISH Network's tech department I'm counting for this extraordinary device to pair nicely with my already extraordinary Sling Adapter.

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